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1. product pro?le 1.1 general description ultra low capacitance bidirectional electrostatic discharge (esd) protection diode in a sod882 leadless ultra small surface-mounted device (smd) plastic package designed to protect one signal line from the damage caused by esd and other transients. 1.2 features 1.3 applications 1.4 quick reference data pesd5v0x1bl ultra low capacitance bidirectional esd protection diode rev. 02 16 july 2009 product data sheet n bidirectional esd protection of one line n esd protection up to 9 kv n ultra low diode capacitance: c d = 0.9 pf n iec 61000-4-2; level 4 (esd) n very low leakage current: i rm =1na n aec-q101 quali?ed n usb interfaces n cellular handsets and accessories n antenna protection n portable electronics n 10/100/1000 mbit/s ethernet n communication systems n firewire n computers and peripherals n high-speed data lines n audio and video equipment n subscriber identity module (sim) card protection table 1. quick reference data t amb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit per diode v rwm reverse standoff voltage - - 5 v c d diode capacitance f = 1 mhz; v r = 0 v - 0.9 1.3 pf
pesd5v0x1bl_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 16 july 2009 2 of 11 nxp semiconductors pesd5v0x1bl ultra low capacitance bidirectional esd protection diode 2. pinning information [1] the marking bar indicates pin 1. 3. ordering information 4. marking 5. limiting values [1] device stressed with ten non-repetitive esd pulses. table 2. pinning pin description simpli?ed outline graphic symbol 1 cathode (diode 1) [1] 2 cathode (diode 2) 2 1 transparent top view 006aab041 12 table 3. ordering information type number package name description version pesd5v0x1bl - leadless ultra small plastic package; 2 terminals; body 1.0 0.6 0.5 mm sod882 table 4. marking codes type number marking code pesd5v0x1bl xx table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit per device t j junction temperature - 150 c t amb ambient temperature - 55 +150 c t stg storage temperature - 65 +150 c table 6. esd maximum ratings t amb =25 c unless otherwise speci?ed. symbol parameter conditions min max unit per diode v esd electrostatic discharge voltage iec 61000-4-2 (contact discharge) [1] -9kv mil-std-883 (human body model) -10kv
pesd5v0x1bl_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 16 july 2009 3 of 11 nxp semiconductors pesd5v0x1bl ultra low capacitance bidirectional esd protection diode table 7. esd standards compliance standard conditions per diode iec 61000-4-2; level 4 (esd) > 8 kv (contact) mil-std-883; class 3 (human body model) > 4 kv fig 1. esd pulse waveform according to iec 61000-4-2 001aaa631 i pp 100 % 90 % t 30 ns 60 ns 10 % t r = 0.7 ns to 1 ns
pesd5v0x1bl_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 16 july 2009 4 of 11 nxp semiconductors pesd5v0x1bl ultra low capacitance bidirectional esd protection diode 6. characteristics table 8. characteristics t amb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit per diode v rwm reverse standoff voltage - - 5 v i rm reverse leakage current v rwm = 5 v - 1 100 na v br breakdown voltage i r = 5 ma 6.0 7.5 9.5 v c d diode capacitance f=1mhz v r = 0 v - 0.9 1.3 pf v r = 5 v - 0.8 1.2 pf r dif differential resistance i r = 1 ma - - 100 w f = 1 mhz; t amb =25 c fig 2. diode capacitance as a function of reverse voltage; typical values fig 3. v-i characteristics for a bidirectional esd protection diode v r (v) 05 4 23 1 006aab249 0.88 0.92 0.84 0.96 1.0 c d (pf) 0.80 006aaa676 - v cl - v br - v rwm v cl v br v rwm - i rm i rm - i r i r - i pp i pp - +
pesd5v0x1bl_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 16 july 2009 5 of 11 nxp semiconductors pesd5v0x1bl ultra low capacitance bidirectional esd protection diode fig 4. esd clamping test setup and waveforms 006aab336 50 w r z c z dut (device under test) gnd gnd 450 w rg 223/u 50 w coax esd tester iec 61000-4-2 network c z = 150 pf; r z = 330 w 4 ghz digital oscilloscope 10 attenuator gnd gnd unclamped +8 kv esd pulse waveform (iec 61000-4-2 network) clamped +8 kv esd pulse waveform (iec 61000-4-2 network) pin 1 to 2 unclamped - 8 kv esd pulse waveform (iec 61000-4-2 network) clamped - 8 kv esd pulse waveform (iec 61000-4-2 network) pin 1 to 2 vertical scale = 2 kv/div horizontal scale = 15 ns/div vertical scale = 20 v/div horizontal scale = 100 ns/div vertical scale = 20 v/div horizontal scale = 100 ns/div vertical scale = 2 kv/div horizontal scale = 15 ns/div
pesd5v0x1bl_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 16 july 2009 6 of 11 nxp semiconductors pesd5v0x1bl ultra low capacitance bidirectional esd protection diode 7. application information pesd5v0x1bl is designed for the protection of one bidirectional data or signal line from the damage caused by esd. the device may be used on lines where the signal polarities are both, positive and negative with respect to ground. circuit board layout and protection device placement circuit board layout is critical for the suppression of esd and electrical fast transient (eft). the following guidelines are recommended: 1. place the device as close to the input terminal or connector as possible. 2. the path length between the device and the protected line should be minimized. 3. keep parallel signal paths to a minimum. 4. avoid running protected conductors in parallel with unprotected conductors. 5. minimize all printed-circuit board (pcb) conductive loops including power and ground loops. 6. minimize the length of the transient return path to ground. 7. avoid using shared transient return paths to a common ground point. 8. ground planes should be used whenever possible. for multilayer pcbs, use ground vias. 8. test information 8.1 quality information this product has been quali?ed in accordance with the automotive electronics council (aec) standard q101 - stress test quali?cation for discrete semiconductors , and is suitable for use in automotive applications. fig 5. application diagram 006aab250 pesd5v0x1bl gnd line to be protected
pesd5v0x1bl_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 16 july 2009 7 of 11 nxp semiconductors pesd5v0x1bl ultra low capacitance bidirectional esd protection diode 9. package outline 10. packing information [1] for further information and the availability of packing methods, see section 14 . fig 6. package outline pesd5v0x1bl (sod882) 03-04-17 dimensions in mm 0.55 0.47 0.65 0.62 0.55 0.50 0.46 cathode marking on top side 1.02 0.95 0.30 0.22 0.30 0.22 2 1 table 9. packing methods the indicated -xxx are the last three digits of the 12nc ordering code. [1] type number package description packing quantity 10000 pesd5v0x1bl sod882 2 mm pitch, 8 mm tape and reel -315
pesd5v0x1bl_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 16 july 2009 8 of 11 nxp semiconductors pesd5v0x1bl ultra low capacitance bidirectional esd protection diode 11. soldering re?ow soldering is the only recommended soldering method. fig 7. re?ow soldering footprint pesd5v0x1bl (sod882) solder lands solder resist occupied area solder paste sod882_fr 0.9 0.3 (2 ) r0.05 (8 ) 0.6 (2 ) 0.7 (2 ) 0.4 (2 ) 1.3 0.7 dimensions in mm
pesd5v0x1bl_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 16 july 2009 9 of 11 nxp semiconductors pesd5v0x1bl ultra low capacitance bidirectional esd protection diode 12. revision history table 10. revision history document id release date data sheet status change notice supersedes pesd5v0x1bl_2 20090716 product data sheet - pesd5v0x1ba_ pesd5v0x1bl_1 modi?cations: ? type number pesd5v0x1ba removed ? figure 5 : updated ? section 13 legal inf or mation : updated pesd5v0x1ba_ pesd5v0x1bl_1 20081104 product data sheet - -
pesd5v0x1bl_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 16 july 2009 10 of 11 nxp semiconductors pesd5v0x1bl ultra low capacitance bidirectional esd protection diode 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 13.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 13.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors pesd5v0x1bl ultra low capacitance bidirectional esd protection diode ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 16 july 2009 document identifier: pesd5v0x1bl_2 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 15. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 application information. . . . . . . . . . . . . . . . . . . 6 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 packing information. . . . . . . . . . . . . . . . . . . . . . 7 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 13.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 14 contact information. . . . . . . . . . . . . . . . . . . . . 10 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

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